Lead 부품의 실장기술
1. Introduction
2. Types Of Surface Mount Technology
3. Fine Pitch Devices
4. Surface Mount Design
5. Solder Paste Application
6. Surface Mount Components and Their Placement
7. Soldering
8. Cleaning
9. Repair/Rework
10. Conclusion
11. Revision Summary

실장기술의 혁신
■ ABSTRACT
■ INTRODUCTION
■ MOUNTING AND SOLDERING
■ CONVECTION HEATED REFLOW
■ CONVECTION/INFRARED REFLOW
■ VAPOR PHASE REFLOW
■ TEST SETUP
■ THERMAL PERFORMANCE
■ PRINTED CIRCUIT BOARD MOUNTING
■ SUBSTRATE MOUNTING
■ POWER SUBSTRATE TRADEOFFS
■ IMS
■ CONCLUSIONS

전력반도체 실장
■ INTRODUCTION
■ MOUNTING SURFACE PREPARATION
■ INTERFACE DECISIONS
■ INSULATION CONSIDERATIONS
■ FASTENER AND HARDWARE CHARACTERISTICS
■ FASTENING TECHNIQUES
■ FREE AIR AND SOCKET MOUNTING
■ CONNECTING AND HANDLING TERMINALS
■ CLEANING CIRCUIT BOARDS
■ THERMAL SYSTEM EVALUATION

SMD Design
■ S.M.D. Background
■ Surface Mount Means Change
■ Change In Technology
■ Solder Paste
■ New Equipment Necessary
■ Changes For The Printed Circuit Board
■ Delivery Systems For Automation
■ Future Needs
■ Life Support Policy

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